ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION

An organosilicon compound represented by formula (1).(R1 is an alkyl, alkenyl, aryl, or acyl group, R2 is an alkyl or aryl group, R3 is a hydrogen atom or a methyl group, A1 is a single bond or an alkylene group, A2, A3, and A4 are each a methylene group or an oxygen atom, with the proviso that at l...

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Bibliographische Detailangaben
Hauptverfasser:	YASUDA, Shigeki, URATA, Minoru
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	An organosilicon compound represented by formula (1).(R1 is an alkyl, alkenyl, aryl, or acyl group, R2 is an alkyl or aryl group, R3 is a hydrogen atom or a methyl group, A1 is a single bond or an alkylene group, A2, A3, and A4 are each a methylene group or an oxygen atom, with the proviso that at least one of the A2, A3, and A4 moieties is an oxygen atom, and n is an integer of 1-3.)