SEMICONDUCTOR CHIP COMPRISING STRUCTURED METALLIZATION WITH INCREASED RELIABILITY, AND MANUFACTURING METHOD

SEMICONDUCTOR CHIP COMPRISING STRUCTURED METALLIZATION WITH INCREASED RELIABILITY, AND MANUFACTURING METHOD

The present disclosure relates to a semiconductor chip, having an aluminium layer, wherein said aluminium layer has a structuration of at least a portion of a surface receiving an additional deposition (Cu), and wherein said structuration forms peaks on said portion of surface occupying between 20 a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PICHON, Pierre-Yves
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present disclosure relates to a semiconductor chip, having an aluminium layer, wherein said aluminium layer has a structuration of at least a portion of a surface receiving an additional deposition (Cu), and wherein said structuration forms peaks on said portion of surface occupying between 20 and 80% of said portion of surface.