HEAT-CONDUCTIVE SILICONE COMPOSITION

The present invention is a thermally conductive silicone composition including: (A) an organopolysiloxane represented by the following general formula (1) having a kinematic viscosity at 25°C of 10 to 10,000 mm2/s, (B) an organopolysiloxane other than the component (A), represented by the following...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TSUJI Kenichi, YAMADA Kunihiro, AKIBA Shota
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention is a thermally conductive silicone composition including: (A) an organopolysiloxane represented by the following general formula (1) having a kinematic viscosity at 25°C of 10 to 10,000 mm2/s, (B) an organopolysiloxane other than the component (A), represented by the following general formula (2) and having a kinematic viscosity at 25°C of 1,000 to 100,000 mm2/s, (C) an organosilane represented by the following general formula (3), and (D) a thermally conductive filler having a thermal conductivity of 10 W/m·°C or more. By the above composition, a thermally conductive silicone composition which does not cause a thickening phenomenon during preservation and has excellent shift resistance is provided. R3cSiO(4-c)/2 (2) R4dR5eSi(OR6)4-d-e (3)