SYSTEM FOR DEPOSITION OF MATERIAL

A system (10) for depositing a material (12), the system (10) comprising a die (14) for extruding the material (12) along a principal deposition direction (28) through an opening (22) of the die (14), wherein the die (14) comprises: a cavity (20) fluidly connected to the opening (22); anda flow guid...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM, Ki Hun, PARK, Jong Goo, SHIN, Jong Woo, LEE, Jae Pil, MUN, Kyoung Rok, KANG, Sung Mo
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KIM, Ki Hun
PARK, Jong Goo
SHIN, Jong Woo
LEE, Jae Pil
MUN, Kyoung Rok
KANG, Sung Mo
description A system (10) for depositing a material (12), the system (10) comprising a die (14) for extruding the material (12) along a principal deposition direction (28) through an opening (22) of the die (14), wherein the die (14) comprises: a cavity (20) fluidly connected to the opening (22); anda flow guide (40, 40a-c) extending through the cavity (20) towards the opening (22) for shaping a flow of the material (12) extruded via the opening (22) and flowing past a side (48, 48a-d) of the flow guide (40, 4oa-c) in the cavity (20),wherein the side (48, 48a-d) of the flow guide (40, 4oa-c) comprises a widening side portion (50, 50a-b), wherein a width of the widening side portion (50, 50a-b) increases along the principal deposition direction (28) towards the opening (22).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4279184A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4279184A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4279184A13</originalsourceid><addsrcrecordid>eNrjZFAMjgwOcfVVcPMPUnBxDfAP9gzx9PdT8HdT8HUMcQ3ydPThYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmRuaWhhYmjobGRCgBAN7YIeQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM FOR DEPOSITION OF MATERIAL</title><source>esp@cenet</source><creator>KIM, Ki Hun ; PARK, Jong Goo ; SHIN, Jong Woo ; LEE, Jae Pil ; MUN, Kyoung Rok ; KANG, Sung Mo</creator><creatorcontrib>KIM, Ki Hun ; PARK, Jong Goo ; SHIN, Jong Woo ; LEE, Jae Pil ; MUN, Kyoung Rok ; KANG, Sung Mo</creatorcontrib><description>A system (10) for depositing a material (12), the system (10) comprising a die (14) for extruding the material (12) along a principal deposition direction (28) through an opening (22) of the die (14), wherein the die (14) comprises: a cavity (20) fluidly connected to the opening (22); anda flow guide (40, 40a-c) extending through the cavity (20) towards the opening (22) for shaping a flow of the material (12) extruded via the opening (22) and flowing past a side (48, 48a-d) of the flow guide (40, 4oa-c) in the cavity (20),wherein the side (48, 48a-d) of the flow guide (40, 4oa-c) comprises a widening side portion (50, 50a-b), wherein a width of the widening side portion (50, 50a-b) increases along the principal deposition direction (28) towards the opening (22).</description><language>eng ; fre ; ger</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; PERFORMING OPERATIONS ; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231122&amp;DB=EPODOC&amp;CC=EP&amp;NR=4279184A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231122&amp;DB=EPODOC&amp;CC=EP&amp;NR=4279184A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Ki Hun</creatorcontrib><creatorcontrib>PARK, Jong Goo</creatorcontrib><creatorcontrib>SHIN, Jong Woo</creatorcontrib><creatorcontrib>LEE, Jae Pil</creatorcontrib><creatorcontrib>MUN, Kyoung Rok</creatorcontrib><creatorcontrib>KANG, Sung Mo</creatorcontrib><title>SYSTEM FOR DEPOSITION OF MATERIAL</title><description>A system (10) for depositing a material (12), the system (10) comprising a die (14) for extruding the material (12) along a principal deposition direction (28) through an opening (22) of the die (14), wherein the die (14) comprises: a cavity (20) fluidly connected to the opening (22); anda flow guide (40, 40a-c) extending through the cavity (20) towards the opening (22) for shaping a flow of the material (12) extruded via the opening (22) and flowing past a side (48, 48a-d) of the flow guide (40, 4oa-c) in the cavity (20),wherein the side (48, 48a-d) of the flow guide (40, 4oa-c) comprises a widening side portion (50, 50a-b), wherein a width of the widening side portion (50, 50a-b) increases along the principal deposition direction (28) towards the opening (22).</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAMjgwOcfVVcPMPUnBxDfAP9gzx9PdT8HdT8HUMcQ3ydPThYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmRuaWhhYmjobGRCgBAN7YIeQ</recordid><startdate>20231122</startdate><enddate>20231122</enddate><creator>KIM, Ki Hun</creator><creator>PARK, Jong Goo</creator><creator>SHIN, Jong Woo</creator><creator>LEE, Jae Pil</creator><creator>MUN, Kyoung Rok</creator><creator>KANG, Sung Mo</creator><scope>EVB</scope></search><sort><creationdate>20231122</creationdate><title>SYSTEM FOR DEPOSITION OF MATERIAL</title><author>KIM, Ki Hun ; PARK, Jong Goo ; SHIN, Jong Woo ; LEE, Jae Pil ; MUN, Kyoung Rok ; KANG, Sung Mo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4279184A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Ki Hun</creatorcontrib><creatorcontrib>PARK, Jong Goo</creatorcontrib><creatorcontrib>SHIN, Jong Woo</creatorcontrib><creatorcontrib>LEE, Jae Pil</creatorcontrib><creatorcontrib>MUN, Kyoung Rok</creatorcontrib><creatorcontrib>KANG, Sung Mo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Ki Hun</au><au>PARK, Jong Goo</au><au>SHIN, Jong Woo</au><au>LEE, Jae Pil</au><au>MUN, Kyoung Rok</au><au>KANG, Sung Mo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM FOR DEPOSITION OF MATERIAL</title><date>2023-11-22</date><risdate>2023</risdate><abstract>A system (10) for depositing a material (12), the system (10) comprising a die (14) for extruding the material (12) along a principal deposition direction (28) through an opening (22) of the die (14), wherein the die (14) comprises: a cavity (20) fluidly connected to the opening (22); anda flow guide (40, 40a-c) extending through the cavity (20) towards the opening (22) for shaping a flow of the material (12) extruded via the opening (22) and flowing past a side (48, 48a-d) of the flow guide (40, 4oa-c) in the cavity (20),wherein the side (48, 48a-d) of the flow guide (40, 4oa-c) comprises a widening side portion (50, 50a-b), wherein a width of the widening side portion (50, 50a-b) increases along the principal deposition direction (28) towards the opening (22).</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP4279184A1
source esp@cenet
subjects APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
ELECTRICITY
PERFORMING OPERATIONS
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title SYSTEM FOR DEPOSITION OF MATERIAL
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T01%3A13%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM,%20Ki%20Hun&rft.date=2023-11-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4279184A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true