SYSTEM FOR DEPOSITION OF MATERIAL

A system (10) for depositing a material (12), the system (10) comprising a die (14) for extruding the material (12) along a principal deposition direction (28) through an opening (22) of the die (14), wherein the die (14) comprises: a cavity (20) fluidly connected to the opening (22); anda flow guid...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Ki Hun, PARK, Jong Goo, SHIN, Jong Woo, LEE, Jae Pil, MUN, Kyoung Rok, KANG, Sung Mo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRICITY PERFORMING OPERATIONS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A system (10) for depositing a material (12), the system (10) comprising a die (14) for extruding the material (12) along a principal deposition direction (28) through an opening (22) of the die (14), wherein the die (14) comprises: a cavity (20) fluidly connected to the opening (22); anda flow guide (40, 40a-c) extending through the cavity (20) towards the opening (22) for shaping a flow of the material (12) extruded via the opening (22) and flowing past a side (48, 48a-d) of the flow guide (40, 4oa-c) in the cavity (20),wherein the side (48, 48a-d) of the flow guide (40, 4oa-c) comprises a widening side portion (50, 50a-b), wherein a width of the widening side portion (50, 50a-b) increases along the principal deposition direction (28) towards the opening (22).