CONNECTION SCHEME WITH BACKSIDE POWER DISTRIBUTION NETWORK

CONNECTION SCHEME WITH BACKSIDE POWER DISTRIBUTION NETWORK

Provided is a system (1) for routing connections to a logic circuit, the system including a first wafer (100) having a backside (120) and a frontside (110) opposite the backside (120), a power conductor (210) at the backside of the first wafer (100), a core (600) at the frontside (110) of the first...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SEO, Kangill, PARK, Saehan, LEE, Seungyoung
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided is a system (1) for routing connections to a logic circuit, the system including a first wafer (100) having a backside (120) and a frontside (110) opposite the backside (120), a power conductor (210) at the backside of the first wafer (100), a core (600) at the frontside (110) of the first wafer (100), a power via (300) electrically connected to the power conductor (210) and to the core (600), a signal pad (400) at the backside (120) of the first wafer (100), a first frontside signal-routing metal (112a) at the frontside (110) of the first wafer (100), and a signal via (400) connected to the signal pad (510) and the first frontside signal-routing metal (112a).