CONTACT PIN FOR HIGH SPEED SIGNAL SEMICONDUCTOR DEVICE TEST, AND SPRING CONTACT AND SOCKET DEVICE COMPRISING SAME

The present invention relates to: a contact pin enabling a maximum compression distance to be ensured while having the minimum length suitable for a test of a high speed signal semiconductor device (IC); and a spring contact and a socket device comprising same. A contact pin (100) according to the present invention comprises: a plate-shaped body portion (110) having a width and a thickness; a head portion (120) integrally formed at the upper end of the body portion (110); and a leg portion (130) integrally formed to extend from the lower end of the body portion (110), wherein the head portion (120) is a plate-shaped strip (122) having the same length to the left and the right with respect to the center of the body portion (110) at the upper end of the body portion (110) and having upper tip portions (121) formed along the upper end thereof, and comprises: a first strip section (122a) located on the same plane as the body portion (110) and provided to have the same length to the left and the right with respect to the center of the body portion (110); and second strip sections (122b) rolled from each of both-end portions of the first strip section (122a) to have a semicircular arc shape so that the first strip section (122a) is located in the diameter direction of a cylindrical shape formed by all of the second strip sections (122b), the body portion (110) has a recessed groove (111) formed at the center of each of both surfaces thereof so as to be recessed in the longitudinal direction thereof, a lower end portion of the recessed groove (111) has a hooking protrusion (111a) having a step, and the top of the recessed groove (111) extends to the top of the first strip section (122a) so as to be open.