HOT-STAMPED MOLDED BODY

This hot-stamping formed body includes, as a chemical composition, by mass%: C: 0.15% or more and 0.50% or less; Si: 0.10% or more and 3.00% or less; Mn: 0.10% or more and 3.00% or less; P: less than 0.10%; S: less than 0.10%; N: less than 0.10%; Ti: 0.020% or more and 0.150% or less; B: 0.002% or m...

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Bibliographische Detailangaben
Hauptverfasser: FUJINAKA, Shingo, MURASAWA, Kodai, TODA, Yuri
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:This hot-stamping formed body includes, as a chemical composition, by mass%: C: 0.15% or more and 0.50% or less; Si: 0.10% or more and 3.00% or less; Mn: 0.10% or more and 3.00% or less; P: less than 0.10%; S: less than 0.10%; N: less than 0.10%; Ti: 0.020% or more and 0.150% or less; B: 0.002% or more and 0.010% or less; optionally Al, Cr, Mo, Co, Ni, Cu, V, W, Ca, Mg, and REM; and a remainder including Fe and impurities, in which a microstructure of the hot-stamping formed body includes, by volume fraction, 85% or more of martensite and less than 15% of retained austenite, and in the microstructure, a standard deviation of a frequency distribution of nanohardnesses is 0.70 GPa or less, and an average grain size is 4.0 µm or less.