CONTACT LAYER FOR LAYERED MATERIALS
An electronics device comprises a substrate (100), a first layer (102a) of a first layered material arranged over the substrate, a second layer of a second layered material arranged over the substrate, an overlap region, and a contact layer (104). In the overlap region, the second layer is arranged...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | An electronics device comprises a substrate (100), a first layer (102a) of a first layered material arranged over the substrate, a second layer of a second layered material arranged over the substrate, an overlap region, and a contact layer (104). In the overlap region, the second layer is arranged over the first layer, and a section of a bottom surface of the second layer is parallel to a section of a top surface of the first layer. The contact layer is arranged over the first layer and the second layer. The contact layer comprises a plurality of electrically conductive lines and an electrical insulation element. The plurality of electrically conductive lines (108, 108a) comprises a first electrically conductive line and a second electrically conductive line. The first electrically conductive line and/or the second electrically conductive line comprises a superconductor material. The electrical insulation element (114) is arranged between the electrically conductive lines to electrically insulate them from each other. The electronics device further comprises a first electrical contact between the first electrically conductive line and the first layer; and a second electrical contact between the second electrically conductive line and the second layer. A method for manufacturing the electronics device is also disclosed. |
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