INSULATION CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

According to the embodiment, in an insulating circuit board (1) in which a conductor part (3, 4) is bonded to at least one surface of an insulating substrate (2), when XPS analysis of the carbon amount at the surface of the conductor part (3, 4) is performed, the average value of the carbon amounts...

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Bibliographische Detailangaben
Hauptverfasser:	MORIMOTO, Kazumitsu, HIRABAYASHI, Hideaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	According to the embodiment, in an insulating circuit board (1) in which a conductor part (3, 4) is bonded to at least one surface of an insulating substrate (2), when XPS analysis of the carbon amount at the surface of the conductor part (3, 4) is performed, the average value of the carbon amounts at any three locations is within the range of not less than 0 at% and not more than 70 at%. When XPS analysis of the oxygen amount of the conductor part surface is performed, it is favorable for the average value of any three locations to be within the range of not less than 3 at% and not more than 50 at%.