SEMICONDUCTOR PACKAGES WITH WIRING ON RE-DISTRIBUTED BUMPS

SEMICONDUCTOR PACKAGES WITH WIRING ON RE-DISTRIBUTED BUMPS

Semiconductor packages with embedded wiring on re-distributed bumps are described. In an illustrative, non-limiting embodiment, a semiconductor package may include an integrated circuit (IC) having a plurality of pads and a re-distribution layer (RDL) coupled to the IC without any substrate or lead...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Huang, Wen Hung, Mao, Kuan-Hsiang, Lo, Tsung Nan, Mohd Sukemi, Norazham, Siong, Chin Teck
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Semiconductor packages with embedded wiring on re-distributed bumps are described. In an illustrative, non-limiting embodiment, a semiconductor package may include an integrated circuit (IC) having a plurality of pads and a re-distribution layer (RDL) coupled to the IC without any substrate or lead frame therebetween, where the RDL comprises a plurality of terminals, and where one or more of the plurality of pads are wire bonded to a corresponding one or more of the plurality of terminals.