MAGNETRON SPUTTERING SYSTEM WITH TUBULAR SPUTTER CATHODE AND METHOD FOR CONTROLLING A LAYER THICKNESS

MAGNETRON SPUTTERING SYSTEM WITH TUBULAR SPUTTER CATHODE AND METHOD FOR CONTROLLING A LAYER THICKNESS

The present disclosure relates to a magnetron sputtering system comprising a substrate to be coated and a magnetron sputtering device comprising at least one rotatable tubular cathode, a mask positioned between the cathode and the substrate and at least one magnet, wherein the magnet is tiltably sup...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BIETHAN, Jens-Peter, HAGEDORN, Harro, STAPP, Martin
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Beschreibung
Zusammenfassung:The present disclosure relates to a magnetron sputtering system comprising a substrate to be coated and a magnetron sputtering device comprising at least one rotatable tubular cathode, a mask positioned between the cathode and the substrate and at least one magnet, wherein the magnet is tiltably supported inside the tubular cathode. The system further comprises a controller, wherein the controller is configured to control a tilt of the at least one magnet and/or a tilt of the at least one rotatable tubular cathode with respect to the substrate to be coated for tuning coating uniformity on the substrate.