LASER PROCESSING DEVICE AND METHOD FOR ADJUSTING FOCAL POSITION OF LASER BEAM USING SAME

Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robo...

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Hauptverfasser: NISHIO, Masatoshi, OHARA, Takayasu, FUKUMITSU, Yoichi
Format: Patent
Sprache:eng ; fre ; ger
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creator NISHIO, Masatoshi
OHARA, Takayasu
FUKUMITSU, Yoichi
description Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robot arm (41) in a manner rotatable about axis (RA), and connector component (50) that connects arm tip shaft (J6) and laser head (60). Connector component (50) is provided with gauge attachment portion (51a) to which gauge (80) is attached removably. Gauge (80) has a reference point corresponding to the focal position of laser beam (LB).
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language eng ; fre ; ger
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title LASER PROCESSING DEVICE AND METHOD FOR ADJUSTING FOCAL POSITION OF LASER BEAM USING SAME
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