LASER PROCESSING DEVICE AND METHOD FOR ADJUSTING FOCAL POSITION OF LASER BEAM USING SAME

Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robo...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIO, Masatoshi, OHARA, Takayasu, FUKUMITSU, Yoichi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robot arm (41) in a manner rotatable about axis (RA), and connector component (50) that connects arm tip shaft (J6) and laser head (60). Connector component (50) is provided with gauge attachment portion (51a) to which gauge (80) is attached removably. Gauge (80) has a reference point corresponding to the focal position of laser beam (LB).