HOT-STAMPED COMPONENT AND METHOD FOR MANUFACTURING SAME

According to an aspect of the present disclosure, provided is a method of manufacturing a hot stamping component in which a residual stress analysis value satisfies a preset condition. The method includes heating a blank; forming a molded body by hot stamping the blank; and cooling the molded body t...

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Bibliographische Detailangaben
Hauptverfasser: HWANG, Kyu Yeon, JUNG, Seung Pill, KIM, Hye Jin, JUNG, Hyun Yeong, LEE, Jin Ho
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:According to an aspect of the present disclosure, provided is a method of manufacturing a hot stamping component in which a residual stress analysis value satisfies a preset condition. The method includes heating a blank; forming a molded body by hot stamping the blank; and cooling the molded body to form a hot stamped component. The residual stress analysis value may be a product of a magnitude of an X-ray diffraction analysis (XRD) value obtained by quantifying residual stress by XRD analysis and a magnitude of an electron backscatter diffraction (EBSD) value obtained by quantifying an orientation by EBSD analysis, and the preset condition is about 2.85* 10-4 Degree∗MPa/µm2 or greater and about 0.05 Degree∗MPa/µm2 or less.