SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINT

A substrate processing system includes a factory interface, a transfer chamber of heptagonal shape and including four first facets and three second facets, each having a width that is narrower than that of each of the four first facets. A processing chamber is attached to one of the four first facet...

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Bibliographische Detailangaben
Hauptverfasser: MYO, Nyi Oo, CHU, Schubert S, LEE, Songjae, KUCHAR, Michael C, MERRY, Nir, KOSHTI, Sushant S
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A substrate processing system includes a factory interface, a transfer chamber of heptagonal shape and including four first facets and three second facets, each having a width that is narrower than that of each of the four first facets. A processing chamber is attached to one of the four first facets. A first auxiliary chamber attached to a first of the three second facets and is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A second auxiliary chamber is attached to a third of the three second facets. The load lock is attached to the transfer chamber between the first and second auxiliary chambers. A robot is attached to a bottom of the transfer chamber and adapted to transfer substrates to/from the first processing chamber, the first auxiliary chamber, and the load lock.