ELECTRONIC MODULE

An electronic module that comprises a housing that receives at least one electronic component is disclosed. The housing contains a fiber-reinforced polymer composition comprising a polymer matrix that contains a thermoplastic polymer and a plurality of long reinforcing fibers that are distributed wi...

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Bibliographische Detailangaben
Hauptverfasser:	EASTEP, David W, JOHNSON, Aaron H
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ANALOGOUS ARRANGEMENTS USING OTHER WAVES ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS PRINTED CIRCUITS RADIO DIRECTION-FINDING RADIO NAVIGATION TESTING THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	An electronic module that comprises a housing that receives at least one electronic component is disclosed. The housing contains a fiber-reinforced polymer composition comprising a polymer matrix that contains a thermoplastic polymer and a plurality of long reinforcing fibers that are distributed within the polymer matrix. The polymer composition exhibits a dielectric constant of about 4 or less and dissipation factor of about 0.01 or less at a frequency of 2 GHz. Further, the polymer composition exhibits a Charpy unnotched impact strength of about 20 kJ/m2 or more as determined in accordance with ISO Test No. 179-1:2010 at a temperature of about 23° C.