HEM FLANGE BONDING METHOD
A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a ro...
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| creator | CAKIC, Goran GALLO, Dominique MUNZINGER, Noah |
| description | A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a room temperature solid, crystalline polyester polyol PP. This enables compositions that are suitable for spray application and are not expressed from the hem flange in the crimping operation. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4263659A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4263659A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4263659A13</originalsourceid><addsrcrecordid>eNrjZJD0cPVVcPNx9HN3VXDy93Px9HNX8HUN8fB34WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJkZmxmamlo6GxkQoAQC4Qh9X</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEM FLANGE BONDING METHOD</title><source>esp@cenet</source><creator>CAKIC, Goran ; GALLO, Dominique ; MUNZINGER, Noah</creator><creatorcontrib>CAKIC, Goran ; GALLO, Dominique ; MUNZINGER, Noah</creatorcontrib><description>A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a room temperature solid, crystalline polyester polyol PP. This enables compositions that are suitable for spray application and are not expressed from the hem flange in the crimping operation.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231025&DB=EPODOC&CC=EP&NR=4263659A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231025&DB=EPODOC&CC=EP&NR=4263659A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAKIC, Goran</creatorcontrib><creatorcontrib>GALLO, Dominique</creatorcontrib><creatorcontrib>MUNZINGER, Noah</creatorcontrib><title>HEM FLANGE BONDING METHOD</title><description>A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a room temperature solid, crystalline polyester polyol PP. This enables compositions that are suitable for spray application and are not expressed from the hem flange in the crimping operation.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD0cPVVcPNx9HN3VXDy93Px9HNX8HUN8fB34WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJkZmxmamlo6GxkQoAQC4Qh9X</recordid><startdate>20231025</startdate><enddate>20231025</enddate><creator>CAKIC, Goran</creator><creator>GALLO, Dominique</creator><creator>MUNZINGER, Noah</creator><scope>EVB</scope></search><sort><creationdate>20231025</creationdate><title>HEM FLANGE BONDING METHOD</title><author>CAKIC, Goran ; GALLO, Dominique ; MUNZINGER, Noah</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4263659A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>CAKIC, Goran</creatorcontrib><creatorcontrib>GALLO, Dominique</creatorcontrib><creatorcontrib>MUNZINGER, Noah</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAKIC, Goran</au><au>GALLO, Dominique</au><au>MUNZINGER, Noah</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEM FLANGE BONDING METHOD</title><date>2023-10-25</date><risdate>2023</risdate><abstract>A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a room temperature solid, crystalline polyester polyol PP. This enables compositions that are suitable for spray application and are not expressed from the hem flange in the crimping operation.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | HEM FLANGE BONDING METHOD |
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