HEM FLANGE BONDING METHOD

A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a ro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CAKIC, Goran, GALLO, Dominique, MUNZINGER, Noah
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a room temperature solid, crystalline polyester polyol PP. This enables compositions that are suitable for spray application and are not expressed from the hem flange in the crimping operation.