IMPLANTABLE SENSOR ELECTRONICS PACKAGING

IMPLANTABLE SENSOR ELECTRONICS PACKAGING

An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WALSER, Jochen, SHAHRIARI, Navid, SHEIKHI, Erfan, DLUGOS, Dan, FICHMAN, Mark, LEE, Seulki, MIKHAIL, George, OP DE BEECK, Maria, VU, Binh
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
DIAGNOSIS
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MEDICAL OR VETERINARY SCIENCE
SURGERY
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Beschreibung
Zusammenfassung:An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.