ELECTRONIC DEVICE INCLUDING HOUSING

According to various embodiments disclosed herein, an electronic device comprises a housing and a processor disposed inside the housing. The housing includes: a first concavo-convex pattern formed in a shape corresponding to the shape of a second concavo-convex pattern formed in a jig; and a metal m...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Youngchun, LEE, Hyuckki, SON, Kidoc, PARK, Byounggyu, SONG, Kyunghwan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	According to various embodiments disclosed herein, an electronic device comprises a housing and a processor disposed inside the housing. The housing includes: a first concavo-convex pattern formed in a shape corresponding to the shape of a second concavo-convex pattern formed in a jig; and a metal member including a metal. The jig is formed in order to use electrochemical machining (ECM), and at least a portion of the first concavo-convex pattern may be formed to have a substantially uniform spacing and a substantially uniform height.