WIRE COATING REMOVAL DEVICE AND WIRE FORMING SYSTEM

A wire coating removal device (10, 10A) of any one of the present embodiments includes: a wire feed path (R) through which a wire (90) is fed in a state of being linearly extended; a pair of rotary tools (31) that sandwich the wire (90) from a first direction at a first position on the wire feed pat...

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Bibliographische Detailangaben
Hauptverfasser: OBAYASHI, Eiji, FUKATSU, Ryota, NOJIMA, Takashi
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A wire coating removal device (10, 10A) of any one of the present embodiments includes: a wire feed path (R) through which a wire (90) is fed in a state of being linearly extended; a pair of rotary tools (31) that sandwich the wire (90) from a first direction at a first position on the wire feed path (R) and cut off a coating (90B); and a pair of rotary tools (32) that sandwich the wire (90) from a second direction intersecting the first direction, at a second position on the wire feed path (R) and cut off the coating (90B).