PROCESSING METHOD FOR WORKPIECE

A processing method for a workpiece includes forming a first processing groove by a first processing unit, imaging the first processing groove by a first imaging unit and imaging, by a second imaging unit provided on an opposite side of the first imaging unit with respect to the holding table, a pre...

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Bibliographische Detailangaben
Hauptverfasser:	KUBO, Atsushi, HANAJIMA, Satoshi, KOJIMA, Yoshimasa
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A processing method for a workpiece includes forming a first processing groove by a first processing unit, imaging the first processing groove by a first imaging unit and imaging, by a second imaging unit provided on an opposite side of the first imaging unit with respect to the holding table, a predetermined line that is formed in a position corresponding to that of the first processing groove in a thickness direction of the workpiece, detecting whether or not a position of a first center line of the first processing groove and a position of a second center line of the predetermined line are aligned in a predetermined plane, and correcting the processing position in such a manner as to make the positions of the two center lines aligned when the detected positions of the first center line and the second center line are not being aligned.