THERMOSETTING RESIN COMPOSITION
Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. The heat-curable resin composition contains:(A) a heat-curable re...
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| creator | INOKUCHI Yoshinori |
| description | Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. The heat-curable resin composition contains:(A) a heat-curable resin; and(B) spherical polymethylphenyl silsesquioxane particles that have a volume average particle size of 0.1 to 30 µm, and are in an amount of 1 to 35 parts by mass per 100 parts by mass of the component (A),wherein a molar ratio between units represented by CH3SiO3/2 and units represented by C6H5SiO3/2 (CH3SiO3/2 units : C6H5SiO3/2 units) in the polymethylphenyl silsesquioxane particles is 95:5 to 55:45. |
| format | Patent |
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The heat-curable resin composition contains:(A) a heat-curable resin; and(B) spherical polymethylphenyl silsesquioxane particles that have a volume average particle size of 0.1 to 30 µm, and are in an amount of 1 to 35 parts by mass per 100 parts by mass of the component (A),wherein a molar ratio between units represented by CH3SiO3/2 and units represented by C6H5SiO3/2 (CH3SiO3/2 units : C6H5SiO3/2 units) in the polymethylphenyl silsesquioxane particles is 95:5 to 55:45.</description><language>eng ; fre ; ger</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241218&DB=EPODOC&CC=EP&NR=4253449A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241218&DB=EPODOC&CC=EP&NR=4253449A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INOKUCHI Yoshinori</creatorcontrib><title>THERMOSETTING RESIN COMPOSITION</title><description>Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. 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| language | eng ; fre ; ger |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | THERMOSETTING RESIN COMPOSITION |
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