THERMOSETTING RESIN COMPOSITION

Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. The heat-curable resin composition contains:(A) a heat-curable re...

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Bibliographische Detailangaben
1. Verfasser:	INOKUCHI Yoshinori
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. The heat-curable resin composition contains:(A) a heat-curable resin; and(B) spherical polymethylphenyl silsesquioxane particles that have a volume average particle size of 0.1 to 30 µm, and are in an amount of 1 to 35 parts by mass per 100 parts by mass of the component (A),wherein a molar ratio between units represented by CH3SiO3/2 and units represented by C6H5SiO3/2 (CH3SiO3/2 units : C6H5SiO3/2 units) in the polymethylphenyl silsesquioxane particles is 95:5 to 55:45.