IMPEDANCE MATCHING STRUCTURE FOR A HIGH-SPEED CONNECTOR AND CONNECTOR

The present disclosure relates an impedance matching structure for a high-speed connector and to a connector. The impedance matching structure (102) comprises two ground leads (104), one differential pair of signal leads (106) and one ground plane (108). Further, the impedance matching structure (102) comprises a first region (110), where the ground leads (104) and the differential pair of signal leads (106) are coplanar within a first plane (116), and a second region (112), where the differential pair of signal leads (106) lies on the first plane (116) and the ground plane (108) lies on a second plane (118), extending along the first plane (116). A transition region (114) is arranged between the first region (110) and the second region (112) and in the transition region (114), the two ground leads (104) are connected to the ground plane (108). Further, the impedance matching structure (102) comprises at least one impedance matching projection (120), which is arranged in the transition region (114) and projects from at least one side of the differential pair of signal leads (106).