SEMICONDUCTOR ELECTRONIC DEVICES INCLUDING SIDEWALL BARRIER LAYERS AND METHODS OF FABRICATING THE SAME

The present disclosure includes a semiconductor device comprising a substrate including a device surface and a patterned metallic electrode disposed on the substrate. The patterned metallic electrode is formed of one or more of copper, gold, and silver. The patterned metallic electrode comprises a l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, Hoon, MANLEY, Robert George
Format: Patent
Sprache:eng ; fre ; ger
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