SEMICONDUCTOR ELECTRONIC DEVICES INCLUDING SIDEWALL BARRIER LAYERS AND METHODS OF FABRICATING THE SAME
The present disclosure includes a semiconductor device comprising a substrate including a device surface and a patterned metallic electrode disposed on the substrate. The patterned metallic electrode is formed of one or more of copper, gold, and silver. The patterned metallic electrode comprises a l...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!