METHOD AND SYSTEM FOR MACHINING MICROTECHNOLOGY WORKPIECES

The present invention relates to an apparatus (1000) for machining hard microtechnology workpieces (1). The apparatus comprises a system (220) for loading/unloading support members (100) for hard workpieces (1) and at least one laser system for machining the hard workpieces (1) and a system for cont...

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Bibliographische Detailangaben
Hauptverfasser: LAMBERT, Fabrice, JACOT, Philippe
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The present invention relates to an apparatus (1000) for machining hard microtechnology workpieces (1). The apparatus comprises a system (220) for loading/unloading support members (100) for hard workpieces (1) and at least one laser system for machining the hard workpieces (1) and a system for controlling the laser (204). Each support member (100) comprises, at least on one side, a surface arranged so that a plurality of hard workpieces (1) can be attached thereto. The apparatus (1000) comprises a device for measuring the X-Y-Z position of each hard workpiece (1) of at least one set of hard workpieces (1) relative to a reference mark and means for recording the X-Y-Z positions, which means are arranged to engage with the laser control system (204). The laser control system comprises a system for positioning the laser (204), which system is arranged to move and position the laser relative to the hard workpiece (1), according to the recorded X-Y-Z position of the hard workpiece (1), such that the hard workpiece (1) can be machined. The invention also relates to a method for machining hard microtechnology workpieces, comprising the different steps (A-F) of: A: providing the machining apparatus (1000) according to the invention and providing a plurality of hard microtechnology workpieces (1); B: providing at least one workpiece support member (100) and attaching the plurality of hard workpieces (1) to the workpiece support member (100); C: inserting at least one of the workpiece support members (100) into a machining unit (200); D: measuring, using the measuring means, the X-Y-Z position, relative to the reference mark, of each of the hard workpieces (1) of at least one set of hard workpieces (1) attached to the workpiece support member (100), and recording the X-Y-Z positions measured by the recording means; E: performing pre-programmed steps of machining the hard workpieces (1) of at least the set by means of the at least one laser (204), the laser (204) being, before each hard workpiece (1) of the set is machined, moved and positioned relative to the hard workpiece (1) according to the X-Y-Z position of the hard workpiece (1), which position is measured and recorded in step D; F: releasing at least one of the hard workpieces (1) from its support member (100).