NARROW PRE-DEPOSITION LASER DELETION

Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any depos...

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Bibliographische Detailangaben
Hauptverfasser:	DIXIT, Abhishek Anant, MARTIN, Todd, PRADHAN, Anshu A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FIXED CONSTRUCTIONS FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES,FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS,BLINDS, GATES FREQUENCY-CHANGING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LADDERS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any deposited layers of the optical device may be removed in a post edge deletion operation.