RESIN, PREPARATION METHOD THEREFOR, RESIN COMPOSITION, AND MOLDED PRODUCT

The present application relates to a resin including a unit of Chemical Formula 1 and a unit of Chemical Formula 2, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIN, Hyeonah, BAE, Jaesoon, YIM, Hye Jin, KIM, Kyeongmun, JUNG, Min Suk, CHOI, Il Hwan
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present application relates to a resin including a unit of Chemical Formula 1 and a unit of Chemical Formula 2, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition.