ALKYLMETHYLSILOXANE LIQUID IMMERSION COOLING MEDIA

A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl h...

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Bibliographische Detailangaben
Hauptverfasser:	BHIDE, Shreyas, ANSEMS BANCROFT, Patricia, LIU, Zhihua, CHEN, Hongyu, PHAN, Son, TANG, Zhengming, WEI, Peng
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPUTING COUNTING DYES ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PHYSICS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl having 6 or more and at the same time 17 or fewer carbon atoms; subscript m has a value of one or higher and at the same time less than 22, subscript n has a value of one or higher, and the sum of m+n is greater than 5 and at the same time less than 50.