ARTIFICIAL REALITY SYSTEM HAVING SYSTEM-ON-A-CHIP (SOC) INTEGRATED CIRCUIT COMPONENTS INCLUDING STACKED SRAM

ARTIFICIAL REALITY SYSTEM HAVING SYSTEM-ON-A-CHIP (SOC) INTEGRATED CIRCUIT COMPONENTS INCLUDING STACKED SRAM

Three-dimensional integrated circuit component(s) are described including a System-on-a-Chip (SoC) die and a separate static random-access memory (SRAM) subcomponent in a vertically stacked arrangement. Such stacked SoC/SRAM integrated circuit components may form part of a system to render artificia...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PENDSE, Rajendra D
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Three-dimensional integrated circuit component(s) are described including a System-on-a-Chip (SoC) die and a separate static random-access memory (SRAM) subcomponent in a vertically stacked arrangement. Such stacked SoC/SRAM integrated circuit components may form part of a system to render artificial reality images.