REMOVAL OF DEFECTS BY IN-SITU ETCHING DURING CHEMICAL-MECHANICAL POLISHING PROCESSING

REMOVAL OF DEFECTS BY IN-SITU ETCHING DURING CHEMICAL-MECHANICAL POLISHING PROCESSING

Technologies for a process used to reduce the height of a raised profile of a device. One or more raised profiles on one or more layers of a device are removed using a combined chemical-mechanical polishing/etching process. In some implementations, a protective layer is applied to a top layer of a d...

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Bibliographische Detailangaben
Hauptverfasser: LAW, Daniel C, FETZER, Christopher M, SINGER, Scott B, BOISVERT, Joseph C
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Technologies for a process used to reduce the height of a raised profile of a device. One or more raised profiles on one or more layers of a device are removed using a combined chemical-mechanical polishing/etching process. In some implementations, a protective layer is applied to a top layer of a device grown on a substrate. A combined chemical-mechanical polishing/etching process may commence whereby one or more raised profiles of the protective layer are removed through a planarization process, exposing at least a portion of a raised profile of a layer below the protective layer. Material may be removed using an etchant to reduce the height of the raised profile.