HOLLOW RESIN PARTICLES AND SHEET

Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 um to 9.0 um, a void...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YABUKI, Nozomi, IGA, Takashi, HIRATA, Takeshi
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 um to 9.0 um, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.