POWER SEMICONDUCTOR DEVICE

A power semiconductor device (1) comprises: a package (2); a plurality of power semiconductor chips (1-1, 1-2, 1 3, ...), each chip (1-1, 1 2, 1-3, ...) comprising a semiconductor body (10), a first load terminal (11), a second load terminal (12) and a control terminal (13). The device (1) comprises a plurality of outside terminals. Said outside terminals comprise: one or more first outside terminals (21) electrically connected with the first load terminals (11); one or more second outside terminals (22), each of which being electrically connected with each of the second load terminals (12); a plurality of third outside terminals (23), wherein each control terminal (13) is electrically connected with at least one individual third outside terminal of the plurality of third outside terminals (23).