POLYIMIDE-BASED RESIN FILM, SUBSTRATE FOR DISPLAY DEVICE USING SAME, AND OPTICAL DEVICE

The present disclosure relates to a polyimide-based resin film wherein a thermal hysteresis gap at a temperature of 50°C or more and 150°C or less is 100 µm or more and 500 µm or less, and a substrate for display device, and an optical device using the same.

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Bibliographische Detailangaben
Hauptverfasser:	HONG, Ye Ji, KANG, Mi Eun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure relates to a polyimide-based resin film wherein a thermal hysteresis gap at a temperature of 50°C or more and 150°C or less is 100 µm or more and 500 µm or less, and a substrate for display device, and an optical device using the same.