MICROCHANNEL CHIP

The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the press...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	YAKUMARU, Kosuke
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TESTING THEIR RELEVANT APPARATUS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (µm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (µm), all of Relational Expressions (1) to (3) are satisfied. Y≥0.4X−2550≥Y≥3X≥40