LINERLESS FILM STACK
A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler ma...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler manufacturing, and a thinner overall construction versus conventional film stacks. |
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