LINERLESS FILM STACK

A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler ma...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: EMSLANDER, Jeffrey O, NIELSEN, John A, TAI, Huiwen
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler manufacturing, and a thinner overall construction versus conventional film stacks.