ELECTRONIC DEVICE COMPRISING SEMICONDUCTOR

An electronic device according to an embodiment may include: a circuit board; a shield can disposed on the circuit board and including an opening; a semiconductor component disposed in a space at least partially surrounded by the circuit board and the shield can; a shield sheet disposed to cover the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SON, Changjong, HWANG, Jieun, AHN, Heecheol, KWAK, Dongyeol, KIM, Juho, PARK, Min, SUNG, Jungoh, JO, Wonbin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic device according to an embodiment may include: a circuit board; a shield can disposed on the circuit board and including an opening; a semiconductor component disposed in a space at least partially surrounded by the circuit board and the shield can; a shield sheet disposed to cover the opening and including a blocking material that blocks at least some of electromagnetic waves generated from the semiconductor component; a partition member disposed between the semiconductor component and the shield sheet, and configured to block at least a portion of an area in which the semiconductor component is disposed from an area in which the semiconductor component is not disposed in a direction in which the semiconductor component is viewed through the opening; and a thermal interface material (TIM) disposed in a space at least partially surrounded by the semiconductor component, the partition member, and the shield sheet. Various other embodiments identified through the specification are possible.