POWER ELECTRONICS MODULE AND METHOD FOR ITS MANUFACTURING
The present disclosure relates to a power electronics module (10) comprising: a substrate (11) with at least a first metallization area (12), a first group of power electronic devices (14) arranged in the first metallization area (12), wherein the first group comprises a plurality of power electroni...
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| creator | LUDWIG, Maxime EHRBAR, Roman |
| description | The present disclosure relates to a power electronics module (10) comprising: a substrate (11) with at least a first metallization area (12), a first group of power electronic devices (14) arranged in the first metallization area (12), wherein the first group comprises a plurality of power electronic devices (14). The power electronics module (10) further comprises a common, uninterrupted joining layer (13) arranged between the first metallization area (12) and the first group of power electronic devices (14), wherein the common, uninterrupted joining layer (13) establishes at least a mechanical and an electrical contact between the first metallization area (12) and the first group of power electronic devices (14).The present disclosure further relates to a method for manufacturing such a power electronics module (10). |
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The power electronics module (10) further comprises a common, uninterrupted joining layer (13) arranged between the first metallization area (12) and the first group of power electronic devices (14), wherein the common, uninterrupted joining layer (13) establishes at least a mechanical and an electrical contact between the first metallization area (12) and the first group of power electronic devices (14).The present disclosure further relates to a method for manufacturing such a power electronics module (10).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240911&DB=EPODOC&CC=EP&NR=4227995B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240911&DB=EPODOC&CC=EP&NR=4227995B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LUDWIG, Maxime</creatorcontrib><creatorcontrib>EHRBAR, Roman</creatorcontrib><title>POWER ELECTRONICS MODULE AND METHOD FOR ITS MANUFACTURING</title><description>The present disclosure relates to a power electronics module (10) comprising: a substrate (11) with at least a first metallization area (12), a first group of power electronic devices (14) arranged in the first metallization area (12), wherein the first group comprises a plurality of power electronic devices (14). 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The power electronics module (10) further comprises a common, uninterrupted joining layer (13) arranged between the first metallization area (12) and the first group of power electronic devices (14), wherein the common, uninterrupted joining layer (13) establishes at least a mechanical and an electrical contact between the first metallization area (12) and the first group of power electronic devices (14).The present disclosure further relates to a method for manufacturing such a power electronics module (10).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | POWER ELECTRONICS MODULE AND METHOD FOR ITS MANUFACTURING |
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