POWER ELECTRONICS MODULE AND METHOD FOR ITS MANUFACTURING
The present disclosure relates to a power electronics module (10) comprising: a substrate (11) with at least a first metallization area (12), a first group of power electronic devices (14) arranged in the first metallization area (12), wherein the first group comprises a plurality of power electroni...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The present disclosure relates to a power electronics module (10) comprising: a substrate (11) with at least a first metallization area (12), a first group of power electronic devices (14) arranged in the first metallization area (12), wherein the first group comprises a plurality of power electronic devices (14). The power electronics module (10) further comprises a common, uninterrupted joining layer (13) arranged between the first metallization area (12) and the first group of power electronic devices (14), wherein the common, uninterrupted joining layer (13) establishes at least a mechanical and an electrical contact between the first metallization area (12) and the first group of power electronic devices (14).The present disclosure further relates to a method for manufacturing such a power electronics module (10). |
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