POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHODS FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

A power semiconductor module arrangement comprises a housing (7), a substrate (10) arranged inside the housing (7), a printed circuit board (81) arranged inside the housing (7) distant from and in parallel to the substrate (10), an encapsulant (5) at least partly filling the interior of the housing...

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Bibliographische Detailangaben
Hauptverfasser:	ARENS, Andre, BOENIG, Guido, LASSMANN, Matthias, LUDWIG, Marco
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A power semiconductor module arrangement comprises a housing (7), a substrate (10) arranged inside the housing (7), a printed circuit board (81) arranged inside the housing (7) distant from and in parallel to the substrate (10), an encapsulant (5) at least partly filling the interior of the housing (7), thereby covering the substrate (10) and the printed circuit board (81), and a heat protective layer (52) arranged inside the housing (7) between the substrate (10) and the printed circuit board (81), and extending in a plane that is parallel to the substrate (10) and the printed circuit board (81), wherein a thermal resistance of the heat protective layer (52) is greater than a thermal resistance of the encapsulant (5).