CURVED WAFER STAGE

Aspects of the present disclosure relate to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target. Further aspects of the present disclosure relate to a wafer stage to be used in such apparatus.According to an aspect of the present disclosure, the wafer chuck comprises a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage further comprises a first motor for rotating the curved shell around a rotational axis. The curved configuration allows for an improved throughput of the wafer stage. The film frame carrier to be used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent such that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and preventing or limiting the ring-shaped body to be bent such that the shape of the mounting surface becomes more convex than the first shape.