DIE ATTACH SYSTEM, AND METHOD OF ATTACHING A DIE TO A SUBSTRATE

DIE ATTACH SYSTEM, AND METHOD OF ATTACHING A DIE TO A SUBSTRATE

A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VAN DER BURG, Richard A, BREWEL, Roy, VAN SPRANG, Wilhelmus G, HOEFS, Rudolphus H
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the die supply source along a first axis; and a second motion system, independent of the first motion system, for moving the die supply source along the first axis.