WIRE ENAMEL COMPOSITION COMPRISING POLYAMIDEIMIDE

The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamidei...

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Bibliographische Detailangaben
Hauptverfasser:	BIONDI, Giovanna, CECI, Andrea, LOGGI, Giovanni
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2.