CHIP-SCALE PACKAGED VERTICAL SEMICONDUCTOR DEVICE

CHIP-SCALE PACKAGED VERTICAL SEMICONDUCTOR DEVICE

Aspects of the present disclosure relate to a vertical semiconductor device. Aspects of the present disclosure further relate to a method for manufacturing such a vertical semiconductor device.According to an aspect of the present disclosure, a vertical semiconductor device is provided that comprise...

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Bibliographische Detailangaben
Hauptverfasser: Funke, Hans-Juergen, Kuipers, Johannes Josinus, Poelma, Rene, Bünning, Hartmut, Berglund, Stefan, Schnitt, Wolfgang, Stokkermans, Joep
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Aspects of the present disclosure relate to a vertical semiconductor device. Aspects of the present disclosure further relate to a method for manufacturing such a vertical semiconductor device.According to an aspect of the present disclosure, a vertical semiconductor device is provided that comprises a conformal coating arranged on its sidewalls. To prevent the conformal coating from covering unwanted areas, such as electrical terminals, a sacrificial layer is arranged prior to arranging the conformal coating. By removing the sacrificial layer, the conformal coating can be removed locally.