ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Aspects of the present disclosure relate to an electronic package and a method for manufacturing the same. The electronic package comprises a semiconductor die having a first surface and an opposing second surface, the semiconductor die having a circuit integrated thereon, wherein each of the first surface and the second surface has a respective terminal arranged thereat, the terminals being electrically connected to the circuit; a conductive element spaced apart from the semiconductor die and having a top surface and a bottom surface; a body of solidified molding compound at least partially encapsulating the semiconductor die and the conductive element, said body having a top side facing the first surface and a bottom side facing the second surface; a first package terminal at the top side that is electrically connected to the terminal at the first surface, and a second package terminal at the top side that is electrically connected to the top surface of the conductive element, wherein the conductive element is separately formed from the first package terminal and the second package terminal; and a conductive layer electrically connecting the bottom surface of the conductive element to the terminal arranged on the second surface of the semiconductor die.