POLYAMIDE, MOLDED BODY AND FILM FORMED OF SAME, AND METHOD FOR PRODUCING SAID POLYAMIDE

The present invention provides a polyamide and a polyamide film which are more sufficiently superior in all of heat-resisting properties, flexibility properties and rubber elastic properties. The present invention relates to a polyamide comprising a unit comprised of an aliphatic dicarboxylic acid (...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAGI, Yusuke, HIROTA, Ami, NAKAI, Makoto, MARUO, Takeshi, TAKAISHI, Naoki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a polyamide and a polyamide film which are more sufficiently superior in all of heat-resisting properties, flexibility properties and rubber elastic properties. The present invention relates to a polyamide comprising a unit comprised of an aliphatic dicarboxylic acid (A) having 18 or more carbon atoms, a unit comprised of an aliphatic diamine (B) having 18 or more carbon atoms, a unit comprised of an aromatic dicarboxylic acid (C) having 12 or less carbon atoms and a unit comprised of an aliphatic diamine (D) having 12 or less carbon atoms, wherein the polyamide has a melting point of 240 °C or more, a crystalline melting enthalpy of 20 J/g or more and an elongation recovery rate of 50 % or more in a hysteresis test, and a polyamide film comprising the polyamide.