HEAT STABLE MULTILAYER BARRIER FILM STRUCTURE

This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer...

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Bibliographische Detailangaben
Hauptverfasser:	CHRISTOPHERSON, Roy, ETTRIDGE, Peter, OKLE, Philipp, LOHWASSER, Wolfgang
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude in the range of from 0.25 μm to 1.0 μm and a wavelength in the range of from 2 μm to 5 μm. Also disclosed are packages (e.g., hermetically sealed packages) formed from the barrier packaging film.