MEANS AND METHOD OF MENISCUS CONFINED ELECTROCHEMICAL DEPOSITION WITH ACCURATE MEANS OF THICKNESS ASSESSMENT

The present invention discloses a system for 3D printing by using meniscus-confined electrodeposition, using at least one pipette, carrying at least one electrolyte, at least one means of thickness or deposition rate assessment and at least one motion control mechanism, configured to allow the depos...

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Bibliographische Detailangaben
Hauptverfasser:	MANSDORF, Nadav, OREN, Eran
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS THEREFOR CASTING CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING METALLIC POWDER WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention discloses a system for 3D printing by using meniscus-confined electrodeposition, using at least one pipette, carrying at least one electrolyte, at least one means of thickness or deposition rate assessment and at least one motion control mechanism, configured to allow the deposition of at least one deposited metal on a substrate. The invention also discloses a method of 3D printing, characterized by one or more steps of meniscus-confined electrodepositing, using at least one pipette, carrying at least one electrolyte, utilizing at least one means of thickness or deposition rate assessment and at least one motion control mechanism, thereby enabling the deposing of at least one deposited metal on a substrate.